====== MBa28 DIP switch settings ======

===== Boot Device Selection (S4 & S5) =====

<callout type="warning">
It is not possible to boot from SD card with the following Hardware combination TQMa28-A[C,D,E] Rev.02XX and MBa28 ≤ Rev.0105. \\
 [[#workaround_sd-card_boot| Click here for a workaround.]]
</callout>

To select the desired boot medium set the DIP switches S4 and S5 accordingly.
The following boot modes of the i.MX28 can be selected by the DIP switches S4 and S5 on the MBa28.

<grid>
<col sm="4">

<panel type="primary" title="SD-Card">
<grid>
<col sm="6">
<WRAP centeralign>
[size=150%]**S4**[/size]
{{ :en:dip_4_0001.png?nolink&180 |}}
</WRAP>
</col>

<col sm="6">
<WRAP centeralign>
[size=150%]**S5**[/size]
{{ :en:dip_4_101x.png?nolink&180 |}}
S5-2: see User Manual, Table 69
</WRAP>
</col>

</grid>
</panel>
</col>

<col sm="4">
<panel type="primary" title="eMMC">
<grid>
<col sm="6">
<WRAP centeralign>
[size=150%]**S4**[/size]
{{ :en:dip_4_0000.png?nolink&180 |}}
</WRAP>
</col>

<col sm="6">
<WRAP centeralign>
[size=150%]**S5**[/size]
{{ :en:dip_4_000x.png?nolink&180 |}}
S5-2: see User Manual, Table 69
</WRAP>
</col>
</grid>
</panel>
</col>

<col sm="4">
<panel type="primary" title="USB Recovery">
<grid>
<col sm="6">
<WRAP centeralign>
[size=150%]**S4**[/size]
{{ :en:dip_4_0100.png?nolink&180 |}}
</WRAP>
</col>

<col sm="6">
<WRAP centeralign>
[size=150%]**S5**[/size]
{{ :en:dip_4_100x.png?nolink&180 |}}
S5-2: see User Manual, Table 69
</WRAP>
</col>
</grid>
</panel>
</col>
</grid>


===== Functional DIP Switches =====

<panel type="primary" title="CAN configuration (S1)">
DIP switch S1 is used to configure the CAN interfaces CAN1 and CAN2.
^ DIP  ^ OFF (default)  ^  ON  ^
| S1-1 | CAN1 not terminated  | CAN1 terminated (120Ω)  |
| S1-2 | CAN2 not terminated  | CAN2 terminated (120Ω)  |
| S1-3 | CAN1 slew rate configuration disabled  | CAN1 slew rate configurable by assembling R282  |
| S1-4 | CAN2 slew rate configuration disabled  | CAN2 slew rate configurable by assembling R281  |
</panel>

<panel type="primary" title="RS485 configuration (S3)">
DIP switch S3 is used to configure the RS485 interface.
^  DIP  ^  OFF (default)  ^  ON  ^
|  S3-1  | No function  | No function  |
|  S3-2  | DEBUG = GND  | DEBUG = TQMa28 PU  |
|  S3-3  | RS485 RxD terminated (120Ω)  | RS485 RxD not terminated   |
|  S3-4  | RS485 TxD terminated (120Ω)  | RS485 TxD not terminated   | 
</panel>


===== Workaround SD-Card Boot =====


<panel type="primary">
<grid>
<col sm="8">
Partlist
  * hookup wire
  * 1k resistor

TODO

  * solder hookup wire from DIP S4-2 to DIP S5-3 (On is printed on the side of DIP switch)
  * solder 1k resistor to Dip S5-3 (Number 3 is printed on the side of DIP switch) 
  * solder Connection between 1k resistor and the outer solder pad of R9
  * set DIP S5-3 on 
</col>
<col sm="4">
{{ :en:arm:tqma28:mba28:mba28_mod.png?nolink&250|}}
</col>
</grid>
</panel>