Embedded module TQMa117xL

All TQ Systems products come with comprehensive documentation to help you get started and integrate our hardware into your designs.

Publicly Available User Manuals & Datasheets

The following documents can be downloaded directly from our Website (no login required) for the desired product:

User Manual (Baseboard)
Detailed hardware descriptions, installation steps, jumper settings, connector layouts and troubleshooting tips.
User Manual (Module)
Electrical specifications, interface overviews, software setup guides and reference tables.
Datasheets
Absolute maximum ratings, timing diagrams and ordering information.

Customer Info Archive (Starter Kit Customers)

The archive includes:

• Mainboard schematic & placement diagram
• Module CAD files (native format)
• Module mechanical dimensions (2D/3D drawings)
• Pinmuxing configuration (recommended device tree fragments)
• Pinout reference (signal assignments, voltage domains)
• Design checklist (layout guidelines, EMI/ESD considerations)
• Processing instructions (LGA Modules)

The NXP Secure Provisioning Tool can generate a Manufacturing Package that contains the binary to be flashed and platform-specific scripts (Mac, Linux, Windows) with your exact manual flashing configuration. You can create this package in the “Write image” tab of the Secure Provisioning Tool by clicking the button next to “Start flashloader”.

The example linker script MIMXRT1176xxxxx_cm7_ram.ld in the BSP repository shows how to properly configure and utilize the different internal RAM regions of the RT1170 processor. It demonstrates optimal memory allocation by placing code in fast ITCM, non-cacheable data in OCRAM1, and regular data/stack/heap in OCRAM2 for maximum performance.
You can find more information about the internal RAM in the NXP Reference Manual for the RT1170.

The TQMa117xL BSP provides three linker script variants for the M7 core, each tailored to a different memory layout. In all three cases the application image itself is stored in the external FlexSPI NOR flash, since this is the only non-volatile memory on the module. The variants differ in where the code is executed from and where runtime data is placed:

• MIMXRT1176xxxxx_cm7_ram.ld: The ROM copies the entire image from FlexSPI into internal RAM at boot time and runs it from there (“Load-to-RAM” boot). Highest execution speed, no runtime dependency on FlexSPI or SDRAM. Suitable for applications that fit into internal RAM.
• MIMXRT1176xxxxx_cm7_flexspi_nor.ld: The application is executed directly from FlexSPI NOR flash (XIP – Execute-In-Place). Runtime data, stack and heap reside in the internal DTCM. Suitable for medium-sized applications.
• MIMXRT1176xxxxx_cm7_flexspi_nor_sdram.ld: The application is executed from FlexSPI NOR (XIP), but runtime data, the stack and the heap reside in external SDRAM. Suitable for larger applications. Requires careful debugger configuration.
  

The variant is selected via the `bootDisk` build option (`ram`, `flash`, or `sd_ram`). You can find more information about the boot modes and memory architecture in the NXP Reference Manual for the RT1170.