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| — | en:x86:tqmx60eb:bios_overview [2018/09/12 12:25] – created schmid | ||
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| + | ^ BIOS Revision | ||
| + | | **5.12.09.53.15** | ||
| + | | ::: | ::: | HM170 | ::: | TQMx60_70EB_5.12.09.53.15_hm170.bin | ||
| + | ^ ^^^^^ | ||
| + | | **5.12.09.44.13** | ||
| + | | ::: | ::: | ::: | 2x4 PCIe Lanes | TQMx60_70EB_5.12.09.44.13_cm236_PCIe_2x4.bin | ||
| + | | ::: | ::: | HM170 | 8x1 PCIe Lanes | TQMx60_70EB_5.12.09.44.13_hm170.bin | ||
| + | | ::: | ::: | ::: | 2x4 PCIe Lanes | TQMx60_70EB_5.12.09.44.13_hm170_PCIe_2x4.bin | ||
| + | ^ ^^^^^ | ||
| + | | **5.11.32.0016.05** | ||
| + | | ::: | ::: | HM170 | ::: | TQMx60EB_5.11.32.0016.05_X64_hm170.bin | ||
| + | |||
| + | ===== Changelog ===== | ||
| + | |||
| + | ++++ 5.12.09.53.15 | | ||
| + | * Insyde core update to tag 05.12.09.0053 / Close security gap Spectre Variant 2, 3a and 4 | ||
| + | * add ME FW ME_11.8_Corporate_11.8.55.3510 (for CM236) | ||
| + | * add ME FW CSME_11.8_Consumer_11.8.55.3510 (for HM170) | ||
| + | * add chipset SKU HM170 | ||
| + | * disable ME_5MB_SUPPORT (for HM170) | ||
| + | * enable Usage of SPI Flashes not listed | ||
| + | * hide EC version | ||
| + | * hide Fab ID | ||
| + | * adapt LCD control shown in SCU | ||
| + | * integrate H2OUVE support | ||
| + | |||
| + | ++++ | ||
| + | ++++ 5.12.09.44.13 | | ||
| + | * Insyde core update to tag 05.12.09.0044 | ||
| + | * add PEG PCI Express configuration menu | ||
| + | * add ME FW ME_11.8_Corporate_11.8.50.3434 (close security gap) | ||
| + | * add ME FW ME_11.8_Consumer_11.8.50.3434 | ||
| + | * add support for SPI flash GD 25Q127C | ||
| + | * fix wrong negative temperature shown in HWM | ||
| + | * hide Fahrenheit temperature shown in HWM | ||
| + | * use Insyde function for 3 x reset processing | ||
| + | * fix no DP output with Xeon CPU with GT2 graphic | ||
| + | * add UEFI-LVDS functunality | ||
| + | * correct LVDS resolutions in setup menu | ||
| + | * Correct SMBIOS data | ||
| + | * add GPIO/ | ||
| + | * add eDP to LVDS bridge information in SioTqmx86 driver | ||
| + | * change to UEFI Boot Type by default | ||
| + | * Make IRQ 5, 6 and 7 for COMs in SioTqmx86 driver adjustable | ||
| + | * Do not suppress LCD Control when UEFI Boot Type | ||
| + | * adapt VBIOS and GOP configuration | ||
| + | * Add Consumer ME Firmware (for HM170) | ||
| + | * Add Chipset SKU HM170 (for HM170) | ||
| + | * Add Chipset SKU CM238 (for CM238) | ||
| + | |||
| + | ++++ | ||
| + | ++++ 5.11.32.0016.05 | | ||
| + | * add and support GOP version 9.0.1051 | ||
| + | * add and support VBIOS version 1046 | ||
| + | * reserve some IRQs (10, 11 and 12) | ||
| + | * add SioXr28v382 package for EXAR UART | ||
| + | * add support for XEON CPU with GT2 graphic | ||
| + | * remove MEBx front page icon | ||
| + | * fix lost setup values if CMOS is lost | ||
| + | * add USB touch support | ||
| + | * remove thunderbolt support | ||
| + | * add verb table for ALC262 codec on COME6-2 | ||
| + | * switch from textual form browser to ' | ||
| + | * disable Console Redirection by default | ||
| + | * add TQ Logo | ||
| + | * add current SioNct7802y from TQMx50UC | ||
| + | * add current SioTqmx86 from TQMx50UC | ||
| + | * remove LPC decode range 0x0680..0x068F | ||
| + | * remove LPC decode range 0x1640..0x164F | ||
| + | * disable SioNct6776f | ||
| + | * adapt SMBIOS data to TQ | ||
| + | * add ME FW ME_11.0_Corporate_11.0.17.1002 | ||
| + | * Enable snap-screen support | ||
| + | |||
| + | ++++ | ||