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en:x86:tqmx60eb:bios_overview [2018/09/12 12:25] (current)
schmid created
Line 1: Line 1:
 +^  BIOS Revision ​ ^  ME Firmware Version ​ ^  Chipset ​ ^  PCI Configurations ​ ^  BIOS Binary ​ ^
 +|  **5.12.09.53.15** ​ |  11.8.55.3510 ​ |  CM236  |  8x1 PCIe Lanes  | TQMx60_70EB_5.12.09.53.15.bin ​ |
 +|  :::  |  :::  |  HM170  |  :::  | TQMx60_70EB_5.12.09.53.15_hm170.bin ​ |
 +^  ^^^^^
 +|  **5.12.09.44.13** ​ |  11.8.50.3434 ​ |  CM236  |  8x1 PCIe Lanes  | TQMx60_70EB_5.12.09.44.13_cm236.bin ​ |
 +|  :::  |  :::  |  :::  |  2x4 PCIe Lanes  | TQMx60_70EB_5.12.09.44.13_cm236_PCIe_2x4.bin ​ |
 +|  :::  |  :::  |  HM170  |  8x1 PCIe Lanes  | TQMx60_70EB_5.12.09.44.13_hm170.bin ​ |
 +|  :::  |  :::  |  :::  |  2x4 PCIe Lanes  | TQMx60_70EB_5.12.09.44.13_hm170_PCIe_2x4.bin ​ |
 +^  ^^^^^
 +|  **5.11.32.0016.05** ​ |  11.0.17.1002 ​ |  CM236  |  8x1 PCIe Lanes  | TQMx60EB_5.11.32.0016.05_X64_cm236.bin ​ |
 +|  :::  |  :::  |  HM170  |  :::  | TQMx60EB_5.11.32.0016.05_X64_hm170.bin ​ |
  
 +
 +===== Changelog =====
 +
 +++++ 5.12.09.53.15 |
 +  * Insyde core update to tag 05.12.09.0053 / Close security gap Spectre Variant 2, 3a and 4
 +  * add ME FW ME_11.8_Corporate_11.8.55.3510 (for CM236)
 +  * add ME FW CSME_11.8_Consumer_11.8.55.3510 (for HM170)
 +  * add chipset SKU HM170
 +  * disable ME_5MB_SUPPORT (for HM170)
 +  * enable Usage of SPI Flashes not listed
 +  * hide EC version ​
 +  * hide Fab ID
 +  * adapt LCD control shown in SCU
 +  * integrate H2OUVE support
 +
 +++++
 +++++ 5.12.09.44.13 |
 +  * Insyde core update to tag 05.12.09.0044
 +  * add PEG PCI Express configuration menu
 +  * add ME FW ME_11.8_Corporate_11.8.50.3434 (close security gap)
 +  * add ME FW ME_11.8_Consumer_11.8.50.3434
 +  * add support for SPI flash GD 25Q127C
 +  * fix wrong negative temperature shown in HWM
 +  * hide Fahrenheit temperature shown in HWM
 +  * use Insyde function for 3 x reset processing
 +  * fix no DP output with Xeon CPU with GT2 graphic ​
 +  * add UEFI-LVDS functunality
 +  * correct LVDS resolutions in setup menu
 +  * Correct SMBIOS data
 +  * add GPIO/​SD-Card information in SioTqmx86 driver
 +  * add eDP to LVDS bridge information in SioTqmx86 driver
 +  * change to UEFI Boot Type by default
 +  * Make IRQ 5, 6 and 7 for COMs in SioTqmx86 driver adjustable
 +  * Do not suppress LCD Control when UEFI Boot Type
 +  * adapt VBIOS and GOP configuration
 +  * Add Consumer ME Firmware (for HM170)
 +  * Add Chipset SKU HM170 (for HM170)
 +  * Add Chipset SKU CM238 (for CM238)
 + 
 +++++
 +++++ 5.11.32.0016.05 |
 +  * add and support GOP version 9.0.1051
 +  * add and support VBIOS version 1046
 +  * reserve some IRQs (10, 11 and 12)
 +  * add SioXr28v382 package for EXAR UART
 +  * add support for XEON CPU with GT2 graphic
 +  * remove MEBx front page icon
 +  * fix lost setup values if CMOS is lost
 +  * add USB touch support
 +  * remove thunderbolt support
 +  * add verb table for ALC262 codec on COME6-2
 +  * switch from textual form browser to '​normal'​ look&​feel
 +  * disable Console Redirection by default
 +  * add TQ Logo
 +  * add current SioNct7802y from TQMx50UC
 +  * add current SioTqmx86 from TQMx50UC
 +  * remove LPC decode range 0x0680..0x068F
 +  * remove LPC decode range 0x1640..0x164F
 +  * disable SioNct6776f
 +  * adapt SMBIOS data to TQ
 +  * add ME FW ME_11.0_Corporate_11.0.17.1002
 +  * Enable snap-screen support
 +
 +++++

en/x86/tqmx60eb/bios_overview.txt · Last modified: 2018/09/12 12:25 by schmid


Disclaimer

TQ-Systems GmbH provides the Board Support Packages (BSP) free of charge. The software included in the shipment has been configured individually for the starter kits. The software is only intended to evaluate the module. The use of the Board Support Packages (BSP) is only allowed within the scope of functionality described by TQ-Systems GmbH. TQ-Systems GmbH does not accept any liability for all further changes of the Board Support Package and for any damage resulting from its use.


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