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en:arm:tqma28:mba28:dip_switches [2013/11/18 11:31] – created lenzen:arm:tqma28:mba28:dip_switches [2022/08/04 15:02] (current) – external edit 127.0.0.1
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 ====== MBa28 DIP switch settings ====== ====== MBa28 DIP switch settings ======
  
-===== Boot Medium Selection (S4 & S5) =====+===== Boot Device Selection (S4 & S5) ===== 
 + 
 +<callout type="warning"> 
 +It is not possible to boot from SD card with the following Hardware combination TQMa28-A[C,D,E] Rev.02XX and MBa28 ≤ Rev.0105. \\ 
 + [[#workaround_sd-card_boot| Click here for a workaround.]] 
 +</callout>
  
 To select the desired boot medium set the DIP switches S4 and S5 accordingly. To select the desired boot medium set the DIP switches S4 and S5 accordingly.
 +The following boot modes of the i.MX28 can be selected by the DIP switches S4 and S5 on the MBa28.
  
-{{.:STK-MBa28_S4+S5_overview.jpg?500  |}}+<grid> 
 +<col sm="4">
  
-<WRAP clear></WRAP> +<panel type="primary" title="SD-Card"> 
-The following boot modes of the i.MX28 can be selected by the DIP switches S4 and S5 on the MBa28.+<grid> 
 +<col sm="6"> 
 +<WRAP centeralign
 +[size=150%]**S4**[/size] 
 +{{ :en:dip_4_0001.png?nolink&180 |}} 
 +</WRAP> 
 +</col>
  
-<WRAP third column+<col sm="6"> 
-==== SD card ==== +<WRAP centeralign
-{{  .:STK-MBa28_S4+S5_SD-card.jpg?200  | }} ^^^ +[size=150%]**S5**[/size] 
-^ DIP ^  OFF  ^  ON  ^ +{{ :en:dip_4_101x.png?nolink&180 |}} 
-| S4-1 |  X  | | +S5-2: see User Manual, Table 69
-| S4-2 |  X  | | +
-| S4-3 |  X  | | +
-| S4-4 | |  X  | +
-| S5-1 | |  X  | +
-S5-2 |  N/A  || +
-| S5-3 |  N/A  || +
-| S5-4 |  N/A  ||+
 </WRAP> </WRAP>
 +</col>
  
-<WRAP third column+</grid
-==== On-board eMMC ==== +</panel> 
-{{  .:STK-MBa28_S4+S5_eMMC.jpg?200  |}} ^^^ +</col> 
-^ DIP ^  OFF  ^  ON  ^ + 
-| S4-1 |  X  | | +<col sm="4"> 
-| S4-2 |  X  | | +<panel type="primary" title="eMMC"> 
-| S4-3 |  X  | | +<grid> 
-| S4-4 |  X  | | +<col sm="6"> 
-| S5-1 |  X  | | +<WRAP centeralign> 
-| S5-2 |  N/A  || +[size=150%]**S4**[/size] 
-| S5-3 |  N/A  || +{{ :en:dip_4_0000.png?nolink&180 |}}
-| S5-4 |  N/A  ||+
 </WRAP> </WRAP>
 +</col>
  
-<WRAP third column+<col sm="6"> 
-==== USB Recovery Mode ==== +<WRAP centeralign
-{{  .:STK-MBa28_S4+S5_resuce_mode.jpg?200  |}} ^^^ +[size=150%]**S5**[/size] 
-^ DIP ^  OFF  ^  ON  ^ +{{ :en:dip_4_000x.png?nolink&180 |}} 
-| S4-1 |  X  | | +S5-2: see User Manual, Table 69
-| S4-2 | |  X  | +
-| S4-3 |  X  | | +
-| S4-4 |  X  | | +
-| S5-1 | |  X  | +
-S5-2 |  N/A  || +
-| S5-3 |  N/A  || +
-| S5-4 |  N/A  ||+
 </WRAP> </WRAP>
-<WRAP clear></WRAP>+</col> 
 +</grid> 
 +</panel> 
 +</col>
  
----- +<col sm="4"> 
-===== CAN configuration (S1) ===== +<panel type="primary" title="USB Recovery"> 
-DIP switch S1 is used to configure the CAN interfaces CAN1 and CAN2.+<grid> 
 +<col sm="6"> 
 +<WRAP centeralign> 
 +[size=150%]**S4**[/size] 
 +{{ :en:dip_4_0100.png?nolink&180 |}} 
 +</WRAP> 
 +</col>
  
-{{.:STK-MBa28_S1_overview.jpg?500  |}}+<col sm="6"> 
 +<WRAP centeralign> 
 +[size=150%]**S5**[/size] 
 +{{ :en:dip_4_100x.png?nolink&180 |}} 
 +S5-2: see User Manual, Table 69 
 +</WRAP> 
 +</col> 
 +</grid> 
 +</panel> 
 +</col> 
 +</grid>
  
-<WRAP clear></WRAP> + 
-<WRAP half column> +===== Functional DIP Switches ===== 
-==== Termination ==== + 
-^ DIP  ^ OFF (default  ON  ^ +<panel type="primary" title="CAN configuration (S1)"> 
-S1-1 | CAN1 terminated (120Ω)  | CAN1 not terminated +DIP switch S1 is used to configure the CAN interfaces CAN1 and CAN2.
-| S1-2 | CAN2 terminated (120Ω)  | CAN2 not terminated +
-</WRAP> +
-<WRAP half column> +
-==== Slew rate ====+
 ^ DIP  ^ OFF (default)  ^  ON  ^ ^ DIP  ^ OFF (default)  ^  ON  ^
 +| S1-1 | CAN1 not terminated  | CAN1 terminated (120Ω)  |
 +| S1-2 | CAN2 not terminated  | CAN2 terminated (120Ω)  |
 | S1-3 | CAN1 slew rate configuration disabled  | CAN1 slew rate configurable by assembling R282  | | S1-3 | CAN1 slew rate configuration disabled  | CAN1 slew rate configurable by assembling R282  |
 | S1-4 | CAN2 slew rate configuration disabled  | CAN2 slew rate configurable by assembling R281  | | S1-4 | CAN2 slew rate configuration disabled  | CAN2 slew rate configurable by assembling R281  |
-</WRAP> +</panel>
-<WRAP clear></WRAP>+
  
----- +<panel type="primary" title="RS485 configuration (S3)">
-===== RS485 configuration (S3) =====+
 DIP switch S3 is used to configure the RS485 interface. DIP switch S3 is used to configure the RS485 interface.
 +^  DIP  ^  OFF (default)  ^  ON  ^
 +|  S3-1  | No function  | No function  |
 +|  S3-2  | DEBUG = GND  | DEBUG = TQMa28 PU  |
 +|  S3-3  | RS485 RxD terminated (120Ω)  | RS485 RxD not terminated   |
 +|  S3-4  | RS485 TxD terminated (120Ω)  | RS485 TxD not terminated   
 +</panel>
  
-{{.:STK-MBa28_S3_overview.jpg?500  |}} 
  
-<WRAP clear></WRAP> +===== Workaround SD-Card Boot ===== 
-<WRAP half column> + 
-==== Debug==== + 
-^ DIP  ^ OFF (default)  ^  ON  ^ +<panel type="primary"> 
-| S3-1 | No function  | No function  | +<grid
-| S3-2 | DEBUG GND  | DEBUG = TQMa28 PU  | +<col sm="8"
-</WRAP+Partlist 
-<WRAP half column+  * hookup wire 
-==== Termination ==== +  * 1k resistor 
-^ DIP  ^ OFF (default)  ^  ON  ^ + 
-| S3-3 | RS485 RxD terminated (120Ω)  | RS485 RxD not terminated +TODO 
-| S3-4 | RS485 TxD terminated (120Ω)  | RS485 TxD not terminated  | + 
-</WRAP>+  * solder hookup wire from DIP S4-2 to DIP S5-3 (On is printed on the side of DIP switch) 
 +  * solder 1k resistor to Dip S5-(Number 3 is printed on the side of DIP switch 
 +  * solder Connection between 1k resistor and the outer solder pad of R9 
 +  * set DIP S5-3 on  
 +</col> 
 +<col sm="4"> 
 +{{ :en:arm:tqma28:mba28:mba28_mod.png?nolink&250|}} 
 +</col> 
 +</grid> 
 +</panel>
  • Last modified: 2022/08/04 15:04