Differences
This shows you the differences between two versions of the page.
Both sides previous revision Previous revision Next revision | Previous revision | ||
en:arm:tqma28:mba28:dip_switches [2018/07/24 10:25] – fixed link MBa28 manual liedmann | en:arm:tqma28:mba28:dip_switches [2022/08/04 15:02] (current) – external edit 127.0.0.1 | ||
---|---|---|---|
Line 2: | Line 2: | ||
===== Boot Device Selection (S4 & S5) ===== | ===== Boot Device Selection (S4 & S5) ===== | ||
+ | |||
+ | <callout type=" | ||
+ | It is not possible to boot from SD card with the following Hardware combination TQMa28-A[C, | ||
+ | | ||
+ | </ | ||
To select the desired boot medium set the DIP switches S4 and S5 accordingly. | To select the desired boot medium set the DIP switches S4 and S5 accordingly. | ||
- | |||
- | {{.: | ||
- | <WRAP clear></ | ||
The following boot modes of the i.MX28 can be selected by the DIP switches S4 and S5 on the MBa28. | The following boot modes of the i.MX28 can be selected by the DIP switches S4 and S5 on the MBa28. | ||
- | ==== SD card ==== | + | < |
- | ^ |::: | + | <col sm="4"> |
- | ^ |::: | + | |
- | ^ DIP |::: ^ 1 ^ 2 ^ 3 ^ | + | |
- | ^ ON | ::: | | | + | |
- | ^ OFF | ::: | • | • | • | | ::: | | ::: | + | |
- | \\ | + | |
- | <WRAP round important 80%> It is not possible to boot from SD card with the following Hardware combination TQMa28-A[C, | + | |
- | ++++ for a workaround please click here !!! | | + | |
- | Partlist | + | |
- | {{ : | + | |
- | * hookup wire | + | |
- | * 1k resistor | + | |
- | TODO | + | <panel type=" |
+ | < | ||
+ | <col sm=" | ||
+ | <WRAP centeralign> | ||
+ | [size=150%]**S4**[/ | ||
+ | {{ : | ||
+ | </ | ||
+ | </ | ||
- | * solder hookup wire from DIP S4-2 to DIP S5-3 (On is printed on the side of DIP switch) | + | <col sm=" |
- | * solder 1k resistor to Dip S5-3 (Number 3 is printed on the side of DIP switch) | + | <WRAP centeralign> |
- | | + | [size=150%]**S5**[/size] |
- | * set DIP S5-3 on | + | {{ : |
- | ++++ | + | S5-2: see User Manual, Table 69 |
</ | </ | ||
+ | </ | ||
- | ---- | + | </ |
+ | </ | ||
+ | </ | ||
+ | <col sm=" | ||
+ | <panel type=" | ||
+ | < | ||
+ | <col sm=" | ||
+ | <WRAP centeralign> | ||
+ | [size=150%]**S4**[/ | ||
+ | {{ : | ||
+ | </ | ||
+ | </ | ||
- | ==== On-board eMMC ==== | + | <col sm=" |
- | ^ |::: | + | <WRAP centeralign> |
- | ^ |::: | + | [size=150%]**S5**[/size] |
- | ^ DIP |::: ^ 1 ^ | + | {{ :en:dip_4_000x.png? |
- | ^ ON | ::: | | | + | S5-2: see User Manual, Table 69 |
- | ^ OFF | ::: | • | • | • | • | ::: | • | ::: | + | </WRAP> |
+ | </ | ||
+ | </ | ||
+ | </ | ||
+ | </ | ||
- | ---- | + | <col sm=" |
+ | <panel type=" | ||
+ | < | ||
+ | <col sm=" | ||
+ | <WRAP centeralign> | ||
+ | [size=150%]**S4**[/ | ||
+ | {{ : | ||
+ | </ | ||
+ | </ | ||
- | ==== USB Recovery ==== | + | <col sm=" |
- | ^ |::: | + | <WRAP centeralign> |
- | ^ |::: | + | [size=150%]**S5**[/size] |
- | ^ DIP |::: ^ 1 ^ | + | {{ :en:dip_4_100x.png? |
- | ^ ON | ::: | | • | | + | S5-2: see User Manual, Table 69 |
- | ^ OFF | ::: | • | | + | </WRAP> |
+ | </ | ||
+ | </ | ||
+ | </ | ||
+ | </ | ||
+ | </ | ||
- | ---- | + | ===== Functional DIP Switches ===== |
- | ===== CAN configuration (S1) ===== | + | <panel type=" |
DIP switch S1 is used to configure the CAN interfaces CAN1 and CAN2. | DIP switch S1 is used to configure the CAN interfaces CAN1 and CAN2. | ||
- | |||
- | {{.: | ||
- | |||
- | ==== Termination ==== | ||
- | ^ DIP ^ OFF (default) | ||
- | | S1-1 | CAN1 terminated (120Ω) | ||
- | | S1-2 | CAN2 terminated (120Ω) | ||
- | |||
- | ==== Slew rate ==== | ||
^ DIP ^ OFF (default) | ^ DIP ^ OFF (default) | ||
+ | | S1-1 | CAN1 not terminated | ||
+ | | S1-2 | CAN2 not terminated | ||
| S1-3 | CAN1 slew rate configuration disabled | | S1-3 | CAN1 slew rate configuration disabled | ||
| S1-4 | CAN2 slew rate configuration disabled | | S1-4 | CAN2 slew rate configuration disabled | ||
+ | </ | ||
- | + | <panel type=" | |
- | ---- | + | |
- | ===== RS485 configuration (S3) ===== | + | |
DIP switch S3 is used to configure the RS485 interface. | DIP switch S3 is used to configure the RS485 interface. | ||
+ | ^ DIP ^ OFF (default) | ||
+ | | S3-1 | No function | ||
+ | | S3-2 | DEBUG = GND | DEBUG = TQMa28 PU | | ||
+ | | S3-3 | RS485 RxD terminated (120Ω) | ||
+ | | S3-4 | RS485 TxD terminated (120Ω) | ||
+ | </ | ||
- | {{.: | ||
+ | ===== Workaround SD-Card Boot ===== | ||
- | ==== Debug==== | ||
- | ^ DIP ^ OFF (default) | ||
- | | S3-1 | No function | ||
- | | S3-2 | DEBUG = GND | DEBUG = TQMa28 PU | | ||
- | |||
- | |||
- | ==== Termination ==== | ||
- | ^ DIP ^ OFF (default) | ||
- | | S3-3 | RS485 RxD terminated (120Ω) | ||
- | | S3-4 | RS485 TxD terminated (120Ω) | ||
+ | <panel type=" | ||
+ | < | ||
+ | <col sm=" | ||
+ | Partlist | ||
+ | * hookup wire | ||
+ | * 1k resistor | ||
+ | TODO | ||
+ | * solder hookup wire from DIP S4-2 to DIP S5-3 (On is printed on the side of DIP switch) | ||
+ | * solder 1k resistor to Dip S5-3 (Number 3 is printed on the side of DIP switch) | ||
+ | * solder Connection between 1k resistor and the outer solder pad of R9 | ||
+ | * set DIP S5-3 on | ||
+ | </ | ||
+ | <col sm=" | ||
+ | {{ : | ||
+ | </ | ||
+ | </ | ||
+ | </ |