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MBa28 DIP switch settings

It is not possible to boot from SD card with the following Hardware combination TQMa28-A[C,D,E] Rev.02XX and MBa28 ≤ Rev.0105. please goto test

To select the desired boot medium set the DIP switches S4 and S5 accordingly. The following boot modes of the i.MX28 can be selected by the DIP switches S4 and S5 on the MBa28.

SD-Card

S4

S5 S5-2: see User Manual, Table 69

eMMC

S4

S5 S5-2: see User Manual, Table 69

S4 S5
DIP 1 2 3 4 1 2 3 4
ON note N/A
OFF


It is not possible to boot from SD card with the following Hardware combination TQMa28-A[C,D,E] Rev.02XX and MBa28 ≤ Rev.0105

for a workaround please click here !!!


S4 S5
DIP 1 2 3 4 1 2 3 4
ON note N/A
OFF

S4 S5
DIP 1 2 3 4 1 2 3 4
ON note N/A
OFF

DIP switch S1 is used to configure the CAN interfaces CAN1 and CAN2.

DIP OFF (default) ON
S1-1 CAN1 terminated (120Ω) CAN1 not terminated
S1-2 CAN2 terminated (120Ω) CAN2 not terminated
DIP OFF (default) ON
S1-3 CAN1 slew rate configuration disabled CAN1 slew rate configurable by assembling R282
S1-4 CAN2 slew rate configuration disabled CAN2 slew rate configurable by assembling R281

DIP switch S3 is used to configure the RS485 interface.

DIP OFF (default) ON
S3-1 No function No function
S3-2 DEBUG = GND DEBUG = TQMa28 PU
DIP OFF (default) ON
S3-3 RS485 RxD terminated (120Ω) RS485 RxD not terminated
S3-4 RS485 TxD terminated (120Ω) RS485 TxD not terminated
Partlist
  • hookup wire
  • 1k resistor

TODO

  • solder hookup wire from DIP S4-2 to DIP S5-3 (On is printed on the side of DIP switch)
  • solder 1k resistor to Dip S5-3 (Number 3 is printed on the side of DIP switch)
  • solder Connection between 1k resistor and the outer solder pad of R9
  • set DIP S5-3 on
  • Last modified: 2022/08/04 15:04