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Embedded module TQMa335x - Windows EC 2013 BSP documentation


Windows Embedded Compact


Windows Embedded Compact 2013


Preliminary feature list

Windows Embedded Compact 2013
Component Device Interface Function REV.100 Remarks
TQMa335x AM335x UART0 RS485
AM335x UART4 RS232
AM335x USB0 USB HOST USB2517 Switch on mba335x
AM335x USB1 USB OTG USB Device
AM335x DCAN0 CAN 2.0B
AM335x DCAN1 CAN 2.0B
AM335x SGX PowerVR Graphics No hardware acceleration
Temp. Sensor
AM335x I2C1 Bus Access
AM335x SPI0 SPI NOR Flash
AM335x CPSW_3G RGMII FEC 1 1000Base-T with hardware modification
(fixed with MBa335x Rev. ≥103)
AM335x CPSW_3G RGMII FEC 2 1000Base-T with hardware modification
(fixed with MBa335x Rev. ≥103)
AM335x TSC_ADC Touch Tested with ET0700G0DH8
am335x lcd Timing for ET0700G0DH8
am335x buzzer GPIO2.0 on MBa335x
am335x mmc0 SD card interface Writing on SD-Card only with hardware modification
(fixed with MBa335x Rev. ≥103)
am335x mmc1 emmc
mba335x usb2517 usb1 usb 2.0
usb2517 usb2 usb 2.0
usb2517 usb3 usb 2.0
usb2517 usb4 usb 2.0 Not tested
usb2517 usb5 lvds-cmd Not tested
USB2517 USB6 USB 2.0 Not tested
USB2517 USB7 Mini PCIe Not tested

en/arm/tqma335x/ec2013/overview.txt · Last modified: 2017/09/18 18:14 by liedmann


TQ-Systems GmbH provides the Board Support Packages (BSP) free of charge. The software included in the shipment has been configured individually for the starter kits. The software is only intended to evaluate the module. The use of the Board Support Packages (BSP) is only allowed within the scope of functionality described by TQ-Systems GmbH. TQ-Systems GmbH does not accept any liability for all further changes of the Board Support Package and for any damage resulting from its use.

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