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en:x86:tqmx60eb:bios_overview [2018/09/12 12:25] – created schmiden:x86:tqmx60eb:bios_overview [2019/05/29 16:47] – removed content and link to data page sections liedmann
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-^  BIOS Revision  ^  ME Firmware Version  ^  Chipset  ^  PCI Configurations  ^  BIOS Binary  ^ +===== BIOS Overview ===== 
-|  **5.12.09.53.15**  |  11.8.55.3510  |  CM236  |  8x1 PCIe Lanes  | TQMx60_70EB_5.12.09.53.15.bin +{{section>.:data#bios_overview&noheader}}
-|  :::  |  :::  |  HM170  |  :::  | TQMx60_70EB_5.12.09.53.15_hm170.bin +
-^  ^^^^^ +
-|  **5.12.09.44.13**  |  11.8.50.3434  |  CM236  |  8x1 PCIe Lanes  | TQMx60_70EB_5.12.09.44.13_cm236.bin +
-|  :::  |  :::  |  :::  |  2x4 PCIe Lanes  | TQMx60_70EB_5.12.09.44.13_cm236_PCIe_2x4.bin +
-|  :::  |  :::  |  HM170  |  8x1 PCIe Lanes  | TQMx60_70EB_5.12.09.44.13_hm170.bin +
-|  :::  |  :::  |  :::  |  2x4 PCIe Lanes  | TQMx60_70EB_5.12.09.44.13_hm170_PCIe_2x4.bin +
-^  ^^^^^ +
-|  **5.11.32.0016.05**  |  11.0.17.1002  |  CM236  |  8x1 PCIe Lanes  | TQMx60EB_5.11.32.0016.05_X64_cm236.bin +
-|  :::  |  :::  |  HM170  |  :::  | TQMx60EB_5.11.32.0016.05_X64_hm170.bin +
- +
 ===== Changelog ===== ===== Changelog =====
- +{{section>.:data#changelog&noheader}}
-++++ 5.12.09.53.15 | +
-  * Insyde core update to tag 05.12.09.0053 / Close security gap Spectre Variant 2, 3a and 4 +
-  * add ME FW ME_11.8_Corporate_11.8.55.3510 (for CM236) +
-  * add ME FW CSME_11.8_Consumer_11.8.55.3510 (for HM170) +
-  * add chipset SKU HM170 +
-  * disable ME_5MB_SUPPORT (for HM170) +
-  * enable Usage of SPI Flashes not listed +
-  * hide EC version  +
-  * hide Fab ID +
-  * adapt LCD control shown in SCU +
-  * integrate H2OUVE support +
- +
-++++ +
-++++ 5.12.09.44.13 | +
-  * Insyde core update to tag 05.12.09.0044 +
-  * add PEG PCI Express configuration menu +
-  * add ME FW ME_11.8_Corporate_11.8.50.3434 (close security gap) +
-  * add ME FW ME_11.8_Consumer_11.8.50.3434 +
-  * add support for SPI flash GD 25Q127C +
-  * fix wrong negative temperature shown in HWM +
-  * hide Fahrenheit temperature shown in HWM +
-  * use Insyde function for 3 x reset processing +
-  * fix no DP output with Xeon CPU with GT2 graphic  +
-  * add UEFI-LVDS functunality +
-  * correct LVDS resolutions in setup menu +
-  * Correct SMBIOS data +
-  * add GPIO/SD-Card information in SioTqmx86 driver +
-  * add eDP to LVDS bridge information in SioTqmx86 driver +
-  * change to UEFI Boot Type by default +
-  * Make IRQ 5, 6 and 7 for COMs in SioTqmx86 driver adjustable +
-  * Do not suppress LCD Control when UEFI Boot Type +
-  * adapt VBIOS and GOP configuration +
-  * Add Consumer ME Firmware (for HM170) +
-  * Add Chipset SKU HM170 (for HM170) +
-  * Add Chipset SKU CM238 (for CM238) +
-  +
-++++ +
-++++ 5.11.32.0016.05 | +
-  * add and support GOP version 9.0.1051 +
-  * add and support VBIOS version 1046 +
-  * reserve some IRQs (10, 11 and 12) +
-  * add SioXr28v382 package for EXAR UART +
-  * add support for XEON CPU with GT2 graphic +
-  * remove MEBx front page icon +
-  * fix lost setup values if CMOS is lost +
-  * add USB touch support +
-  * remove thunderbolt support +
-  * add verb table for ALC262 codec on COME6-2 +
-  * switch from textual form browser to 'normal' look&feel +
-  * disable Console Redirection by default +
-  * add TQ Logo +
-  * add current SioNct7802y from TQMx50UC +
-  * add current SioTqmx86 from TQMx50UC +
-  * remove LPC decode range 0x0680..0x068F +
-  * remove LPC decode range 0x1640..0x164F +
-  * disable SioNct6776f +
-  * adapt SMBIOS data to TQ +
-  * add ME FW ME_11.0_Corporate_11.0.17.1002 +
-  * Enable snap-screen support +
- +
-+++++
  • Last modified: 2022/08/04 15:02