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Embedded module TQMx60EB Documentation



BIOS Overview

BIOS Revision BIOS Version ME Firmware Version Chipset PCI Configurations BIOS Binary
Rev. 0102 5.12.09.53.15 11.8.55.3510 CM236 8×1 PCIe Lanes TQMx60_70EB_5.12.09.53.15.bin
HM170 TQMx60_70EB_5.12.09.53.15_hm170.bin
Rev. 0101 5.12.09.44.13 11.8.50.3434 CM236 8×1 PCIe Lanes TQMx60_70EB_5.12.09.44.13_cm236.bin
2×4 PCIe Lanes TQMx60_70EB_5.12.09.44.13_cm236_PCIe_2x4.bin
HM170 8×1 PCIe Lanes TQMx60_70EB_5.12.09.44.13_hm170.bin
2×4 PCIe Lanes TQMx60_70EB_5.12.09.44.13_hm170_PCIe_2x4.bin
Rev. 0100 5.11.32.0016.05 11.0.17.1002 CM236 8×1 PCIe Lanes TQMx60EB_5.11.32.0016.05_X64_cm236.bin
HM170 TQMx60EB_5.11.32.0016.05_X64_hm170.bin

Changelog

5.12.09.53.15

  • Insyde core update to tag 05.12.09.0053 / Close security gap Spectre Variant 2, 3a and 4
  • add ME FW ME_11.8_Corporate_11.8.55.3510 (for CM236)
  • add ME FW CSME_11.8_Consumer_11.8.55.3510 (for HM170)
  • add chipset SKU HM170
  • disable ME_5MB_SUPPORT (for HM170)
  • enable Usage of SPI Flashes not listed
  • hide EC version
  • hide Fab ID
  • adapt LCD control shown in SCU
  • integrate H2OUVE support

5.12.09.44.13

  • Insyde core update to tag 05.12.09.0044
  • add PEG PCI Express configuration menu
  • add ME FW ME_11.8_Corporate_11.8.50.3434 (close security gap)
  • add ME FW ME_11.8_Consumer_11.8.50.3434
  • add support for SPI flash GD 25Q127C
  • fix wrong negative temperature shown in HWM
  • hide Fahrenheit temperature shown in HWM
  • use Insyde function for 3 x reset processing
  • fix no DP output with Xeon CPU with GT2 graphic
  • add UEFI-LVDS functunality
  • correct LVDS resolutions in setup menu
  • Correct SMBIOS data
  • add GPIO/SD-Card information in SioTqmx86 driver
  • add eDP to LVDS bridge information in SioTqmx86 driver
  • change to UEFI Boot Type by default
  • Make IRQ 5, 6 and 7 for COMs in SioTqmx86 driver adjustable
  • Do not suppress LCD Control when UEFI Boot Type
  • adapt VBIOS and GOP configuration
  • Add Consumer ME Firmware (for HM170)
  • Add Chipset SKU HM170 (for HM170)
  • Add Chipset SKU CM238 (for CM238)

5.11.32.0016.05

  • add and support GOP version 9.0.1051
  • add and support VBIOS version 1046
  • reserve some IRQs (10, 11 and 12)
  • add SioXr28v382 package for EXAR UART
  • add support for XEON CPU with GT2 graphic
  • remove MEBx front page icon
  • fix lost setup values if CMOS is lost
  • add USB touch support
  • remove thunderbolt support
  • add verb table for ALC262 codec on COME6-2
  • switch from textual form browser to 'normal' look&feel
  • disable Console Redirection by default
  • add TQ Logo
  • add current SioNct7802y from TQMx50UC
  • add current SioTqmx86 from TQMx50UC
  • remove LPC decode range 0x0680..0x068F
  • remove LPC decode range 0x1640..0x164F
  • disable SioNct6776f
  • adapt SMBIOS data to TQ
  • add ME FW ME_11.0_Corporate_11.0.17.1002
  • Enable snap-screen support
  • Last modified: 2022/08/04 15:04